Method and apparatus for dielectric bonding of silicon wafer flow fields
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United States of America Patent
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Issued Date -
Sep 14, 2006
app pub date -
Feb 15, 2006
filing date -
Jan 20, 2004
priority date (Note) -
Abandoned
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Abstract
According to one embodiment of the invention a fuel cell can be configured so as to directly bond silicon substrate flow field plates directly to one another via a dielectric bond without allowing reactant gases to penetrate the flow field plates during operation of the fuel cell.
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