Post deposition plasma cleaning system and method
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United States of America Patent
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Mar 10, 2015
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app pub date -
Mar 21, 2005
filing date -
Mar 21, 2005
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Abstract
A method for processing a substrate includes disposing the substrate in a deposition chamber configured to perform a deposition process and depositing a film on the substrate using the deposition process. The substrate having the film thereon is then transferred from the deposition chamber into a treatment chamber and a plasma cleaning process is performed on the substrate in the treatment chamber. Further processing of the substrate is performed after the plasma cleaning process.
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