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United States of America Patent

SERIAL NO

11383021

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An integrated circuit current sensor includes a lead frame having at least two leads coupled to provide a current conductor portion, and a substrate having a first surface in which is disposed one or more magnetic field sensing elements, with the first surface being proximate to the current conductor portion and a second surface distal from the current conductor portion. In one particular embodiment, the substrate is disposed having the first surface of the substrate above the current conductor portion and the second surface of the substrate above the first surface. In this particular embodiment, the substrate is oriented upside-down in the integrated circuit in a flip-chap arrangement. The current sensor can also include an electromagnetic shield disposed between the current conductor portion and the magnetic field sensing elements.

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Patent Owner(s)

Patent OwnerAddress
ALLEGRO MICROSYSTEMS INC363 PLANTATION STREET WORCESTER MA 01605

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Doogue, Michael C Manchester, NH 83 4442
Gagnon, Jay Holden, MA 13 832
Mangtani, Vijay Nashua, NH 36 1552
Sharma, Nirmal Shrewsbury, MA 18 980
Taylor, WilliamP Amherst, NH 1 67

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