High density integrated circuit having multiple chips and employing a ball grid array (BGA) and method for making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 5, 2006
app pub date -
Oct 5, 2005
filing date -
Apr 4, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
High density integrated circuits and more particularly to a high density integrated circuit incorporating a multiplicity of functional chips arranged on a substrate comprised of a plurality of dielectric and conductive layers which interface the semiconductor dies with a ball gate array (BGA) arranged on the underside of the substrate and wherein the main heat generating areas of the semiconductor dies are directly coupled to selected balls of the BGA for directly carrying heat from the major heat sources away from the device.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully