Structure comprising metallized film and ethylene copolymer
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United States of America Patent
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Issued Date -
Oct 5, 2006
app pub date -
Apr 4, 2005
filing date -
Apr 4, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Disclosed are a multilayer structure, an article therewith, and a process therefor. The article includes packages such as pouch. The structure comprises a metallized film and an ethylene copolymer composition. The process is a lamination process or extrusion coating process with the ethylene copolymer composition providing adhesion of metallized film to a substrate.
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