Ball grid array package and process for manufacturing same
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United States of America Patent
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N/A
Issued Date -
Oct 5, 2006
app pub date -
Mar 17, 2006
filing date -
Jul 19, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A ball grid array integrated circuit package is manufactured by mounting a semiconductor die, to a first surface of a substrate such that bumps on the semiconductor die are electrically connected to conductive traces of the substrate. At least one collapsible spacer is mounted to at least one of a heat spreader, the semiconductor die and the substrate. The heat spreader is fixed to the at least one of the first surface of the substrate and the semiconductor die such that the at least one collapsible spacer is disposed therebetween. A ball grid array is formed on a second surface of the substrate, bumps of the ball grid array being electrically connected to the conductive traces and the integrated circuit package is singulated.
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