Method of manufacturing enhanced thermal dissipation integrated circuit package
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United States of America Patent
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app pub date -
Mar 6, 2006
filing date -
Jul 11, 2001
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Abandoned
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Abstract
The present invention relates to an integrated circuit package having a thermally conductive element thermally coupled to a semiconductor die and a heat sink, and a method of manufacturing said integrated circuit package. The thermally conductive element is integrated into the package to enhance thermal dissipation characteristics of the package.
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