Transferring die(s) from an intermediate surface to a substrate

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United States of America Patent

SERIAL NO

11091944

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Dies that are attached to a die plate can be transferred to a substrate. For example, holes in the die plate can be filled with an expandable material. A stimulus source, such as a laser beam/laser light can be directed to the material in a hole, causing the material to expand. Expansion of the material can cause a die that is covering the hole to be released from the die plate to come into contact with a substrate. A mask can be used to prevent the material in a hole from being expanded by the stimulus source. In another example, a pin plate is used to release a die from the die plate. Pins of the pin plate are selectively actuated to cause selected die(s) to be released. An actuator plate having a plurality of actuators can be moved across the pin plate, with actuator(s) selectively actuating corresponding pin(s).

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Patent Owner(s)

Patent OwnerAddress
SYMBOL TECHNOLOGIES INCONE SYMBOL PLAZA MS/A6 HOLTSVILLE NY 11742

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arneson, Michael R Finksburg, MD 74 2975
Bandy, William R Gambrills, MD 85 3700

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