Importance

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Abstract

Provided is a plaque and its method of manufacture, the plaque including a cured thermoset phenolic resin and a reinforcing material that is molded into a controlled thickness. Also provided is a solder pallet utilizing the plaque in its manufacture. The plaque can be manufactured by forming a preform of the raw materials, preheating the preform, molding the preform into a plaque of the desired thickness, and then cooling the plaque at an elevated temperature to maintain the flatness of the plaque. The plaque can then be formed into the desired solder pallet by cutting the plaque to an appropriate size, if necessary, adding holes an clips for use in a soldering process for soldering circuit boards, for example.

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First Claim