Manufacturing process: how to construct constraining core material into printed wiring board
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United States of America Patent
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N/A
Issued Date -
Oct 19, 2006
app pub date -
Mar 15, 2006
filing date -
Mar 15, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Processes for manufacturing printed wiring boards including electrically conductive constraining cores are disclosed. Several of the processes enable precise alignment of tooling holes used by tools to perform processes with respect to various panels and subassemblies used to form finished printed wiring boards. Modifications to Gerber files that can increase manufacturing yield and provide the ability to detect faulty printed wiring boards in a panelized array of printed wiring boards are also discussed. One embodiment of the invention includes aligning the weave of a woven panel of electrically conductive material relative to a tool surface using at least a pair of references and forming tooling holes in the panel of electrically conductive material.
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