Machine and process for cutting openings in a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Issued Date -
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app pub date -
Apr 21, 2004
filing date -
May 2, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The machine has at least a cutting tool (12), a transfer system (7,8) holding said substrate (1) and driving said substrate (1) along a determined direction. The cutting tool (12) comprises a laser beam (13) that can be moved in two perpendicular directions and evacuation means (11,15) to evacuate a cut part of said substrate (1).
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