MEMS release methods
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United States of America Patent
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N/A
Issued Date -
Oct 19, 2006
app pub date -
Apr 19, 2005
filing date -
Apr 19, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A packaged MEMS device is fabricated by providing a first substrate, forming the MEMS device on the first substrate (the MEMS device including at least one element initially held immobile by a sacrificial material), optionally removing a portion of the sacrificial material without releasing the element, providing a second substrate, forming at least one release port, bonding the second substrate to the first substrate, and removing the sacrificial material through the release port to release the element.
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