Method of manufacturing an implantable wireless sensor
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United States of America Patent
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Aug 18, 2009
Grant Date -
Oct 19, 2006
app pub date -
Jun 22, 2006
filing date -
Sep 16, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In the disclosed method of manufacturing an implantable wireless sensor, a cavity is etched in one side of a first substrate. A conductive structure are formed on the base of the cavity. A second conductive structureare formed on a surface of a second substrate, and the two substrates are mutually imposed such that the two conductive plates and coils are disposed in opposed, spaced-apart relation. A laser is then used to cut away perimeter portions of the imposed substrates and simultaneously to heat bond the two substrates together such that the cavity in the first substrate is hermetically sealed.
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