Card, manufacturing method of card, and thin type battery for card
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United States of America Patent
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N/A
Issued Date -
Oct 26, 2006
app pub date -
Apr 20, 2005
filing date -
Apr 20, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The invention presents a method for manufacturing an IC card with a built-in battery where the seal of the battery does not breakdown during a heating and laminating process. The manufacturing method for the IC card of the invention includes accommodating a thin type battery 1 in a cavity 79 formed by overlaying an inner sheet 73 and a first oversheet 74 on a core sheet 72 having a penetration pole 79a. A second oversheet 75 covers the cavity 79, and a spacer 25 is inserted between a seal section 11 of the thin type battery 1 and second oversheet 75. Pressure and heat are applied to mutually adhere the sheets, wherein the pressing force is applied to the seal section 11 by way of the spacer 25.
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