Substrate for producing a soldering connection to a second substrate
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United States of America Patent
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N/A
Issued Date -
Oct 26, 2006
app pub date -
Mar 29, 2006
filing date -
Mar 29, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A substrate for producing a soldering connection to a second substrate is disclosed. Soldering pads are distributed on the substrate surface. Solder balls can be applied to these pads. A soldering pad has a top side area and side areas connected to a conductor track. A soldering mask with openings in the region of the soldering pads is applied to the substrate. A soldering pad is provided with holding mechanism for the solder balls in such a way that, within the top side area of the soldering pad, a depression is introduced in the direction of the substrate or an elevation rising above the top side area is applied.
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