Reflow soldering method using Pb-free solder alloy and hybrid packaging method and structure
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United States of America Patent
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Issued Date -
Oct 26, 2006
app pub date -
Jul 1, 2004
filing date -
Jul 1, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A hybrid mounting method using a Pb-free solder alloy including a reflow soldering step of soldering a surface mounting component 2 to at least the upper surface of a circuit board 1 using a Pb-free solder paste comprising an alloy based on Sn-(1-4)Ag-(0-1)Cu-(7-10)In (unit, mass %)-based alloy, an insertion step of inserting a lead or a terminal of an insertion mounting component 5 into a through hole perforated through the circuit board 1 from the upper surface thereof, a flux coating step, a preheating step, and a flow soldering step of spraying a jet flow 3 of Pb-free solder to the lower surface of the circuit board 1 preheated by the preheating step, thereby flow soldering the lead or the terminal of an insertion mounting component 5 to the circuit board.
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