Method for evaluating reproduced images of wafers
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United States of America Patent
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Issued Date -
Oct 26, 2006
app pub date -
May 11, 2004
filing date -
Jul 14, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Method for evaluating recorded images of wafers is disclosed. The recording of an image of at least one reference wafer is followed by the determination and representation, on a user interface, of the radial distribution of the measured values of the reference wafer as a radial homogeneity function. A radially dependent sensitivity profile is changed while taking into account the measured radial homogeneity function of the reference wafer. At least one parameter of the sensitivity profile is varied whereby a learned sensitivity profile is determined visually from the comparison with the radial homogeneity function.
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