Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam
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United States of America Patent
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N/A
Issued Date -
Nov 2, 2006
app pub date -
Apr 28, 2005
filing date -
Apr 28, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Systems, methods, and apparatus for connecting a set of contacts on an integrated circuit to a flex circuit via a contact beam are provided. An exemplary chip-scale packaged (CSP) device comprising an integrated circuit having at least one major surface, the at least one major surface having a set of contacts, is provided. The CSP device may further comprise a flex circuit attached to at least a portion of the at least one major surface of the integrated circuit. The flex circuit may further comprise a first conductive layer for connecting a first CSP contact and a second conductive layer for connecting a second CSP contact. The CSP device may further comprise a preferably pre-stressed beam for connecting at least one signal CSP contact to at least one of the set of contacts on the at least one major surface of the integrated circuit.
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