Encapsulating emissive portions of an OLED device
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United States of America Patent
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N/A
Issued Date -
Nov 2, 2006
app pub date -
Apr 28, 2005
filing date -
Apr 28, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method of providing an encapsulation layer over an emissive portion of an OLED device includes providing an OLED substrate having one or more OLED devices, each device having an emissive portion and a connector portion, positioning the OLED substrate in sealing engagement with at least one opening in a deposition chamber to define a deposition environment for the emissive portion(s) and a non-deposition environment for the connector portion(s), and depositing in the deposition environment an encapsulation layer onto the emissive portion of the OLED device through the opening without depositing the encapsulation layer over the connector portion.
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