Sputtering targets and method for the preparation thereof
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United States of America Patent
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app pub date -
Feb 3, 2006
filing date -
Jan 5, 1996
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Abstract
A process for the preparation of a sputtering target which comprises sub-stoichiometric titanium dioxide, TiO.sub.x, where x is below 2, having an electrical resistivity of less than 0.5 ohm.cm, optionally together with niobium oxide, which process comprises plasma spraying titanium dioxide, TiO.sub.2, optionally together with niobium oxide, onto a target base in an atmosphere which is oxygen deficient and which does not contain oxygen-containing compounds, the target vase being coated with TiO.sub.x which is solidified by cooling under conditions which prevent the sub-stiochiometric titanium dioxide from combining with oxygen.
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