Inspection method, manufacturing method of piece for analysis, analysis method, analyzer, manufacturing method of SOI wafer, and SOI wafer

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Mar 2, 2010
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Nov 9, 2006
app pub date
Oct 16, 2003
filing date
Feb 3, 2003

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is measured based upon the accumulated surface images.

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SUMCO CORPORATION

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Inventor Name	Address	# of filed Patents	Total Citations
Kondo, Hideyuki	Tokyo, JP	21	119
Okubo, Akira	Tokyo, JP	37	543

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Inspection method, manufacturing method of piece for analysis, analysis method, analyzer, manufacturing method of SOI wafer, and SOI wafer

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United States of America Patent

10544178

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PATENT NO	7670857
APP PUB NO	20060249479A1
SERIAL NO	10544178
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 02, 2010	US,7670857,B2 US7670857B2	GRANTED PATENT AS SECOND PUBLICATION
November 09, 2006	US,20060249479,A1 US20060249479A1	FIRST PUBLISHED PATENT APPLICATION

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10544178

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