Method of resin transfer molding

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20060249877A1
SERIAL NO

10547406

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention discloses a method of resin transfer molding which comprises superposing a bagging film on a layer of reinforcing fibers laid on a mold, airtightly bonding the periphery of the bagging film to the mold, evacuating the space between the bagging film and the mold, injecting a resin into the space between the bagging film and the mold to thereby impregnate the resin into the reinforcing fibers, and curing the resin, characterized in that resin injection passages and resin discharge passages are alternately formed outside the reinforcing fiber layer along a surface of the reinforcing fiber layer and the resin is injected into the resin injection passages to allow the resin injected to move to the resin discharge passages via the reinforcing fiber layer and thereby impregnate the resin into the reinforcing fiber layer.

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Patent Owner(s)

Patent OwnerAddress
TOHO TENAX CO LTDTOKYO 100-0013

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kaneko, Toru Shizuoka, JP 43 175
Sasaki, Kiyoto Shizuoka, JP 18 8
Umemoto, Yoshitaka Shizuoka, JP 35 291

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