Liquid DIMM Cooler
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United States of America Patent
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-
N/A
Issued Date -
Nov 9, 2006
app pub date -
May 4, 2005
filing date -
May 4, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A liquid cooled heat sink for electronic circuit boards is described. A heat sink base includes a liquid cooling arrangement to remove heat from the base. An arrangement of cooling fins extends from the base, and at least one surface of each fin includes a thermal interface layer. The arrangement is adapted so that the fins fit between parallel electronic circuit boards such that for each circuit board, a thermal contact layer of a fin contacts multiple components on the circuit board so as to conduct heat from the components into the fin, which in turn transfers heat to the heat sink base.
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