Supply plate for an electrochemical system
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United States of America Patent
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N/A
Issued Date -
Nov 16, 2006
app pub date -
Apr 25, 2006
filing date -
Apr 26, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to supply plate (1), a base plate for the assembly of such a supply plate, as well as a method for manufacturing a supply plate for electrochemical systems. Two base plates (2a, 2b) are thermally joined to one another using a joining agent, wherein this joining agent (3) has a lower melting point than the material of the base plates (2a, 2b). At least one first base plate (2a) comprises at least one pocket (4a) into which joining agent is filled, and subsequently the second base plate (2b) is applied onto a joining plane (F) of the first plate, and a connection of the base plates (2a, 2b) is effected by way of the impact of heat on the joining agent.
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