Flexible modular sensor systems
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United States of America Patent
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Mar 9, 2010
Grant Date -
Nov 16, 2006
app pub date -
May 10, 2006
filing date -
May 12, 2005
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Expired
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Abstract
Sensor systems, methods of making sensor modules and circuit modules, and methods of making expanded sensor systems including the sensor modules and circuit modules. A sensor module can include a flexible substrate, internal conductor lines, edge conductor lines for module interconnection, and sensors integrated thereon. One sensor module includes an array of interconnected capacitive pressure tactile sensors (taxels), being row addressable from address lines and readable through data lines. The sensor modules can be bonded to each other to form a larger array of sensors. One bonding method utilizes anisotropic conductive paste (ACP). The sensor system provided can be flexible and easy to expand to cover large areas. By using various sensor modules, the sensor system can be used for various applications. Readout modules can be coupled to the exterior edges to read all the individual sensors. Applications include robotic skin and wearable sensor fabrics.
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Lee, Hyung-Kew | 4-166 EE/Csci Bldg, 200 Union St. SE. | 7 | 152 |
Yoon, Euisik | 3340 Zircon La. N. | 46 | 1270 |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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