Selective removal chemistries for semiconductor applications, methods of production and uses thereof
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United States of America Patent
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app pub date -
Feb 10, 2006
filing date -
Nov 19, 2004
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Abstract
Removal chemistry solutions and methods of production thereof are described herein that include at least one fluorine-based constituent, at least one chelating component, surfactant component, oxidizing component or combination thereof, and at least one solvent or solvent mixture. Removal chemistry solutions and methods of production thereof are also described herein that include at least one low H.sub.2O content fluorine-based constituent and at least one solvent or solvent mixture.
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