Method for encapsulating a semiconductor device and semiconductor device
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United States of America Patent
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Issued Date -
Nov 16, 2006
app pub date -
Mar 24, 2006
filing date -
Mar 24, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
One aspect of the invention relates to a method for encapsulating a semiconductor device which has at least one semiconductor chip arranged on a substrate. The method includes application of an elastic dam to the semiconductor chip, introduction of the semiconductor chip arranged on the substrate into a mold including a lower mold half and an upper mold half, closing of the mold so that the elastic dam is completely contacted by an inner surface of the upper mold half, and encapsulation of the semiconductor device with a molding compound.
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