Methods and apparatus for processing wafers
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Nov 23, 2006
app pub date -
Feb 21, 2006
filing date -
Feb 22, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of processing wafers or batches of wafers sequentially in a vacuum chamber (10). The method involves removing a wafer (25) from a location on a support (11); chemically cleaning particles from the support to form volatile components; and placing the subsequent wafer on the cleaned support. The method is performed without a vacuum break.
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