Integrated circuit device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Jul 28, 2006
filing date -
Dec 14, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A integrated circuit device made using LCD-COG (liquid crystal display-chip on glass) technique is disclosed. The integrated circuit device comprises a substrate, a plurality of dies having surfaces with a plurality of compliant bumps thereon. The compliant bumps are rearranged in any area of the dies for electrically connecting the dies and the substrate. The joint area of the bumps after rearrangement is smaller than the joint area of the bumps on the center. An adhesive is daubed on the joint area of the substrate and the dies for the purpose of jointing the substrate and the dies. By changing the position of the compliant bumps so that they are centrally corresponded on the dies without changing the electrical characteristics and the wiring arrangement of the dies, costs are lowered, reliability is increased and the glass substrate is less easily bent.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully