Design-based method for grouping systematic defects in lithography pattern writing system
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United States of America Patent
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Jul 20, 2010
Grant Date -
Nov 30, 2006
app pub date -
May 15, 2006
filing date -
May 13, 2005
priority date (Note) -
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Abstract
Methods and apparatus for categorizing defects on workpieces, such as semiconductor wafers and masks used in lithographically writing patterns into such wafers are provided. For some embodiments, by analyzing the layout in the neighborhood of the defect, and matching it to similar defected neighborhoods in different locations across the die, defects may be categorized by common structures in which they occur.
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