Module and method for fabricating the same
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United States of America Patent
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N/A
Issued Date -
Dec 7, 2006
app pub date -
Jul 3, 2003
filing date -
Jul 3, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A module having a smaller size with enhanced reliability and productivity, and a method for fabricating the module. The module comprises a connector (6) having metal terminals for connection, and a circuit board (1) mounting electronic components. The connector (6) and the board (1) are connected to each other through metal leads (7). The surface of the connector (6) on the side being connected to the board, the metal leads 7, and the electronic components are sealed with the same thermosetting resin (9). The thermosetting resin (9) is in solid state at temperatures of 40.degree. C. or below before curing, and the thickness of the thermosetting resin (9) sealing the electronic components is changed depending on the heights of the electronic components.
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