Cleaning process for semiconductor substrates
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United States of America Patent
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Issued Date -
Dec 7, 2006
app pub date -
Jun 20, 2005
filing date -
Jul 1, 2004
priority date (Note) -
Abandoned
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Abstract
The present invention relates to cleaning processes for semiconductor substrates. More particularly, the present inventive method can provide enhanced particle removal efficiencies at a given material loss. In fact, in certain embodiments, the present method can achieve particle removal efficiencies of at least about 90%, while yet removing less than about 2 angstroms of any oxide present on the semiconductor substrate. As such, the present methods find particular applicability in the processing of advanced technology nodes.
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