Semiconductor wafer with non-rectangular shaped dice
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United States of America Patent
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Issued Date -
Dec 14, 2006
app pub date -
Mar 12, 2004
filing date -
Mar 13, 2003
priority date (Note) -
Abandoned
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Abstract
A semiconductor wafer having a plurality of dice formed on the wafer. The plurality of dice having non-rectangular shapes with at least one notched corner. A plurality of saw streets are defined between the plurality of dice. At an intersection of two of the plurality of saw streets, a distance is defined between corners of two adjacent dice that is greater than a minimum distance between the two adjacent dice.
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