Method for maching a wafer
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United States of America Patent
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N/A
Issued Date -
Dec 14, 2006
app pub date -
Jun 6, 2006
filing date -
Jun 8, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention relates to a method for machining a wafer, comprising: (a) providing a wafer having an active surface and a backside surface; (b) attaching a plate substrate to the active surface of the wafer; (c) grinding the backside surface of the wafer; (d) removing the plate substrate; and (e) sawing the wafer. Therefore, warping of the thin wafer can be avoided.
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