Method for preventing the overflowing of molding compound during fabricating package device
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United States of America Patent
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N/A
Issued Date -
Dec 21, 2006
app pub date -
Jul 29, 2005
filing date -
Jun 17, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for preventing the overflowing of the molding compound is disclosed. The method provides a substrate that having at least a pair of outer leads. By the pressed downward the pair of outer leads as the thimble point, the substrate can contact with the mold completely without any gap therebetween, thus, the overflowing of the molding compound would not be occurred.
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