Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package
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United States of America Patent
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Issued Date -
Dec 21, 2006
app pub date -
Dec 18, 2002
filing date -
Dec 18, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method for producing a flip-chip mounting electronic component having plural terminals (3) dotted on a mounting face (1) and conductors formed on the terminals (3) realizes flip-chip mounting capable of shortening the distance between bumps (7). To realize this, a step of coating the mounting face (1) with a conductor having a predetermined thickness, a step of masking corresponding positions for the terminal (3) parts on the conductor surface, and a step of removing the conductor except the mask (6) parts are included and performed in this order. The bump is preferably constituted of copper.
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