Method for fabrication of surface mounted metal foil chip resistors
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United States of America Patent
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Issued Date -
Dec 21, 2006
app pub date -
Jun 21, 2005
filing date -
Jun 21, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present invention provides a method for fabricating metal foil chip resistors, comprising: providing an insulator substrate; forming a conductor layer pattern as a terminal electrode on said insulator substrate; adhering a metal foil having specific resistivity to said insulator substrate; applying the resistor wiring pattern upon said metal foil by employing the resist; and patterning the resistor wiring by a chemical etching method. Then said metal foil resistor layer is cut or otherwise processed by employing a laser method or other similar methods, thus a predetermined resistance value is obtained. Subsequently, further steps are performed to finish the process of fabricating metal foil chip resistors.
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