HEATING CHUCK ASSEMBLY
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United States of America Patent
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N/A
Issued Date -
Dec 28, 2006
app pub date -
Mar 24, 2006
filing date -
Jun 20, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A heating chuck assembly for wafer processing is provided, including heating modalities for same. The assembly generally includes hermetically sealed opposingly paired discs, and housed therebetween, a ceramic element interposed between first and second heating elements. The first heating element is adjacent a first disc of the opposingly paired discs so as to be paired therewith, the second heating element adjacent a second disc of the opposingly paired discs so as to be paired therewith. The assembly further contemplates the inclusion of temperature sensing/measuring and controlling devices, in the context of a heating chuck system.
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