Stacked memory card and method for manufacturing the same
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United States of America Patent
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N/A
Issued Date -
Dec 28, 2006
app pub date -
Jun 22, 2005
filing date -
Jun 22, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A structure of stacked memory card, the structure includes a substrate, a lower chip, wires, adhered element, upper chip, and compound resin. The substrate has an upper surface formed with a plurality of first electrodes, and a lower surface. The B-stage glue is coated on the upper surface of the substrate. The lower chip is arranged on the upper surface of the substrate, and is located on the B-stage glue. The plurality of wires are electrically connected the lower chip to the first electrode of the substrate. The adhesive element includes adhesive agent and filling elements is coated on the lower chip. The upper chip is adhered on the lower chip by adhesive element, and is spaced with the lower chip through the filling element, then is electrically connected to the first electrode of the substrate by wires. The compound resin is encapsulated on the upper chip, lower chip, and wires.
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