High frequency circuit module
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United States of America Patent
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N/A
Issued Date -
Dec 28, 2006
app pub date -
Jun 22, 2006
filing date -
Jun 27, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A circuit module with reduced parasitical capacitance. The circuit module comprises a first circuit structure, a second circuit structure, a block layer, a first ground layer, and a second ground layer. The first circuit structure is disposed in a first substrate. The second circuit structure is disposed in a second substrate, and forms a stacked substrate with the first circuit structure. The block layer contacts the stacked substrate. The first ground layer is between the first circuit structure and the second circuit structure. And the second ground layer is electrically coupled to the first ground layer through a connecting segment.
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