Semiconductor packaging structure
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United States of America Patent
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N/A
Issued Date -
Jan 4, 2007
app pub date -
Nov 17, 2005
filing date -
Jun 30, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A semiconductor packaging structure includes a baseboard, a semiconductor chip set, a thermal conductor, a package and a heat sink. The thermal conductor is located on the baseboard. The semiconductor chip set is directly mounted onto the thermal conductor. The heat sink is coupled on the thermal conductor. Hence heat energy generated by the semiconductor chip set, when electrically energized, is transferred through the thermal conductor to the heat sink, to perform heat exchange.
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