Importance

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Abstract

An anti-warp heat spreader for semiconductor devices is disclosed, wherein the heat spreader is made of a metal sheet of substantially constant thickness, the metal sheet being perforated by at least one opening to allow for the percolation of an adhesive or a resin. The heat spreader is designed to strengthen the package by providing a strong bond between its components, i.e., the circuit board, die, heat spreader and reinforcing frame. At the same time the heat generated by the die during operation is efficiently dissipated. The heat spreader can easily be attached to the die by positioning it in the mold used to produce the reinforcing frame and then fill the mold with a mold compound. The mold compound will easily flow through the opening or openings, thereby filling the gap between the heat spreader and the die. The mold compound replaces the air that escapes from the gap through the opening or openings. Thus, a strong and intense connection between the die and the heat spreader is constituted. The bonding layer underneath the heat spreader and the reinforcing frame above the heat spreader are firmly. interconnected through the opening or openings.

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First Claim