Thermosetting resin composition
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United States of America Patent
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Issued Date -
Jan 18, 2007
app pub date -
Nov 20, 2003
filing date -
Nov 22, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A thermosetting resin composition which is improved in impact resistance, thermal crack resistance, oxidative degradation resistance and thermal degradation resistance without impairing the heat resistance represented by HDT and which is suitable for the encapsulation of semiconductors and the like, is provided. The thermosetting resin composition comprises (A) a thermosetting resin, (B) a liquid polybutene containing an aldehyde gourp and (C) a curing agent added at need thereto, wherein the main component of the liquid polybutene has an aldehyde structure at a terminal and the main chain thereof as a structure in which 80% or more of the repeating unit have a structure represented by the Formula (1). The impact resistance and thermal crack resistance are attained by making a phase structure comprised with resin of the thermosetting resin composition after the curing reaction wherein a .mu.m unit size of a dispersed phase which consists primarily of the component derived from an aldehyde group containing liquid polybutene, exists in a continuous phase which consists primarily of the thermosetting resin.
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