Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate
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United States of America Patent
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app pub date -
Jul 19, 2006
filing date -
Jun 7, 2004
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Abandoned
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Abstract
A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.
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