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United States of America Patent
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Issued Date -
Jan 25, 2007
app pub date -
May 31, 2006
filing date -
Jul 20, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A substrate includes a first metal layer containing a first trace, a second metal layer containing a second trace and a dielectric layer arranged between the first and second metal layers. The substrate also includes an electrically conductive signal via electrically coupled to the first and second traces traversing the dielectric layer to form a signal path, wherein physical characteristics of the via are controlled such that signal path characteristics of the via match signal path characteristics of the first and second traces.
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