Laser processing for heat-sensitive mesoscale deposition of oxygen-sensitive materials
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United States of America Patent
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Feb 7, 2012
Grant Date -
Jan 25, 2007
app pub date -
May 8, 2006
filing date -
Sep 30, 1998
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Abstract
D™) to perform direct deposition of material onto the target in a precise, highly localized fashion. Features with linewidths as small as 4 microns may be deposited, with little or no material waste. A laser is preferably used to heat the material to process it to obtain the desired state, for example by chemical decomposition, sintering, polymerization, and the like. This laser processing may be performed in an ambient environment with laser powers of less than 100 milliwatts. Cover gases and/or forming gases may be used during thermal processing to change the material properties, for example by preventing oxidation.
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