Gluing method and device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 1, 2007
app pub date -
Apr 30, 2004
filing date -
May 2, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of gluing a circuit component onto a circuit board. The circuit component has a bottom area with at least one edge for bringing into contact with the circuit board. The distance between the edge and a first line parallel to the edge and an amount of adhesive to be applied per length unit along the line are determined such that, when placing the circuit component on the circuit board,the adhesive advances to the edge but not to a second circuit component adjacent to the edge. The adhesive is applied in the selected quantity along the first line and along further lines which are parallel to the first line and further away from the edge. Then, the circuit component is placed on the circuit board.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully