PRINTED CIRCUIT BOARD INTERCONNECTION AND METHOD
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 1, 2007
app pub date -
Nov 21, 2005
filing date -
Jul 28, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A product of and method for laminating and interconnecting multiple layer printed circuit boards (14) includes at least two complementary substrates (10 and 12) each having a solder bump (30) formed from conductive material (28) applied to a desired component (22). A dam network (34) is formed about the bumps (30) to prevent undesired spreading of the conductive material (28). Bonding material (36) between the surfaces (38a and 38b) of the substrates (10 and 12) bonds the multiple layers. The bonding material (36) has apertures through which the solder bumps (30) are connected.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully