Copper substrate with feedthroughs and interconnection circuits
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United States of America Patent
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Issued Date -
Feb 1, 2007
app pub date -
Jul 27, 2006
filing date -
Aug 1, 2005
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for fabricating a copper-based circuit module is described. The module is built on a copper sheet and has isolated feedthroughs fabricated using a glass frit. High density interconnection circuits are built on the copper sheet, including wells for accepting bumped devices such as integrated circuit chips. The modules can be stacked to form electronic subsystems, with cooling channels optionally provided between pairs of modules.
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