Electro-optic interconnection apparatus and method
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United States of America Patent
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Issued Date -
Feb 1, 2007
app pub date -
Jul 27, 2006
filing date -
Aug 1, 2005
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A construction for attaching an optical fiber to an electro-optic chip is described. The construction includes support for the optical fiber, optionally provided by an aperture in a supporting copper sheet. High density interconnection circuits are fabricated on the copper sheet. Pillar-in-well connections are used between the electro-optic chip and the interconnection circuits, with electrical connections for signals and power, and thermal connections at increased density for cooling the chip. An electronic subsystem employing stacked modules is described, with optical ports at each of the modules.
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